SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. LEAD SILICON PACKAGING TECHNICIAN, SILICON ASSEMBLY (STARLINK) One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world.

In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers and leadership. The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver.

If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step.

RESPONSIBILITIES

: Provide training and mentorship to a growing team of highly skilled silicon assembly technicians Serve a primary path for escalating product non-conformance events as well as elevating and removing blockers to daily production targets Monitor BOM and consumables inventory, and perform regular systematic cycle counts Partner with engineering to drive peak quality pareto improvement and provide tailored training and remediation to technicians and associates Provide daily status updates and escalate issues impacting production target attainment Operate and maintain surface mount technology, automated optical inspection, reflow, aqueous deflux, convection and vacuum bake, compression molding, laser marking, ball grid array, tape mount, singulation, physical vapor deposition, vision, and pick/place machines Monitor process performance using in-situ sensors and metrology equipment such as Scanning Acoustic Microscopy, 3D profilometers, ellipsometers, reflectometers, and X-ray systems to ensure uniformity, interface adhesion, and contamination control Operate dicing saws, laser dicers, and plasma etching tools to perform mechanical, laser, or hybrid singulation techniques on wafers, substrates, printed circuit boards and mechanical subassemblies Follow and monitor recipes for process stability and quality control Load and unload materials into underfill and overmolding systems, following recipes to achieve target mold fill, void minimization, and flash control during production runs Operate die attach equipment, including epoxy dispensers, pick-and-place bonders, and reflow stations, to place and secure dies with micron-level accuracy and controlled bond line thickness Comply with cleanroom gowning protocols (ISO), Chemical Safety Standards, and Strict Electrostatic Discharge (ESD) guidelines BASIC

QUALIFICATIONS

: High school diploma or equivalency certificate 3+ years professional experience in a semiconductor wafer or packaging manufacturing environment; OR bachelor's degree in an engineering, math or science discipline PREFERRED SKILLS AND EXPERIENCE: Bachelor's degree in materials science, electrical engineering, or a related field 3+ years of practical experience in high volume semiconductor manufacturing operations Proficiency in data analysis and process control software for statistical process control (SPC) Physical stamina to manage equipment in a cleanroom suit and handle sensitive substrates Experience with metrology tools such as Confocal Scanning Acoustic Microscopy(C-SAM), 3D Profilometers, Stereoscopes, Optical Tensiometers (Goniometer), X-Ray Fluorescence (XRF) Excellent manual dexterity with the ability to work with both hands under a microscope ADDITIONAL

REQUIREMENTS

: Must be able to work all shifts and be willing to work ove

Lead Silicon Packaging Technician, Silicon Assembly (Starlink)